LM5000 datasheet(5/18 Pages) NSC

5 / 18 page

Electrical Characteristics (Continued)

Specifications in standard type face are for T

J = 25˚C and those with boldface type apply over the full Operating Tempera-

ture Range (T

J = −40˚C to +125˚C) Unless otherwise specified. VIN = 12V and IL = 0A, unless otherwise specified.

Symbol

Parameter

Conditions

Min

(Note 7)

Typ

(Note 8)

Max

(Note 7)

Units

Thermal Resistance

TSSOP, Package only

150

˚C/W

LLP, Package only

Note 4: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to

be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 5: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,

and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation

at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Note 6: The human body model is a 100 pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 7: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%

production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to

calculate Average Outgoing Quality Level (AOQL).

Note 8: Typical numbers are at 25˚C and represent the most likely norm.

Note 9: Bias current flows into FB pin.

Note 10: Supply voltage, bias current product will result in aditional device power dissipation. This power may be significant. The thermal dissipation design should

take this into account.

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