2003 Mar 03

13

Philips Semiconductors

Product specification

Dual buffer/line driver; 3-state

74HC2G126; 74HCT2G126

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.00

0.85

0.60

0.27

0.17

0.23

0.08

2.1

1.9

2.4

2.2

0.5

3.2

3.0

0.4

0.1

8

°

0

°

0.13

0.1

0.2

0.4

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.40

0.15

Q

0.21

0.19

SOT765-1

MO-187

02-06-07

bp

D

Z

e

0.12

14

8

5

θ

A2

A1

Q

Lp

(A3)

detail X

A

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

SOT765-1

1

pin 1 index