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AD8505ARJZ-R2 Datenblatt(PDF) 19 Page - Analog Devices |
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AD8505ARJZ-R2 Datenblatt(HTML) 19 Page - Analog Devices |
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19 / 20 page ![]() AD8505/AD8506/AD8508 Rev. E | Page 19 of 20 COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE Figure 55. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters A B C D E 0.650 0.595 0.540 1.50 1.46 1.42 3.00 2.96 2.92 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) 0.340 0.320 0.300 2.00 BSC BALL 1 IDENTIFIER SEATING PLANE 1.00 BSC 0.50 BSC 0.50 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.50 BSC 0.50 BSC 0.380 0.355 0.330 0.270 0.240 0.210 0.10 MAX COPLANARITY Figure 56. 14-Ball Wafer Level Chip Scale Package [WLCSP] (CB-14-1) Dimensions shown in millimeters |
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