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ZLED7730 Datenblatt(PDF) 3 Page - Integrated Device Technology

Teilenummer ZLED7730
Bauteilbeschribung  High Current 40V LED Driver with Switch Dimming
PDF  22 Pages
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Hersteller  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

ZLED7730 Datenblatt(HTML) 3 Page - Integrated Device Technology

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ZLED7x30 Datasheet
© 2016 Integrated Device Technology, Inc.
3
April 20, 2016
Contents
1
IC Characteristics .......................................................................................................................................................... 5
1.1
Absolute Maximum Ratings ................................................................................................................................... 5
1.2
Operating Conditions ............................................................................................................................................. 5
1.3
Electrical Parameters............................................................................................................................................. 6
1.4
Typical Operation Graphs ...................................................................................................................................... 7
2
Circuit Description ....................................................................................................................................................... 12
2.1
ZLED7x30 Overview ............................................................................................................................................ 12
2.2
Control of Output Current via External Sense Resistor Rs .................................................................................. 12
2.3
Multi-Mode Switch Dimming................................................................................................................................. 12
2.4
ZLED7x30 Protection Features............................................................................................................................ 13
2.4.1
Thermal Shut-down Protection ..................................................................................................................... 13
2.4.2
LED Open-Load Protection........................................................................................................................... 13
3
Application Circuit Design............................................................................................................................................ 14
3.1
Applications.......................................................................................................................................................... 14
3.2
Thermal Considerations for Application Design ................................................................................................... 15
3.2.1
Temperature Effects of Load, Layout, and Component Selection................................................................. 15
3.2.2
Temperature Effects of Low Supply Voltage VIN ........................................................................................... 15
3.3
External Component Selection............................................................................................................................. 15
3.3.1
Sense Resistor Rs ........................................................................................................................................ 15
3.3.2
Inductor L1.................................................................................................................................................... 16
3.3.3
Bypass Capacitor C1 .................................................................................................................................... 17
3.3.4
De-bouncing Capacitor C2............................................................................................................................ 19
3.3.5
Capacitor C3 for Reducing Output Ripple..................................................................................................... 19
3.3.6
Diode D1....................................................................................................................................................... 19
3.4
Application Circuit Layout Requirements ............................................................................................................. 19
4
ESD Protection............................................................................................................................................................ 20
5
Pin Configuration and Package ................................................................................................................................... 20
6
Ordering Information ................................................................................................................................................... 21
7
Document Revision History ......................................................................................................................................... 22



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