| Datenblatt-Suchmaschine für elektronische Bauteile |
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X9409 Datenblatt(PDF) 20 Page - Xicor Inc. |
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X9409 Datenblatt(HTML) 20 Page - Xicor Inc. |
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20 / 21 page ![]() X9409 – Preliminary Information Characteristics subject to change without notice. 20 of 21 REV 1.6 1/30/03 www.xicor.com PACKAGING INFORMATION Ball Matrix: X9409W/X9409Y 4321 A RL1 A1 A2 RW0 B RW1 SDA WP RL0 C VSS RH1 RH0 VCC D NC RH2 RH3 NC E RW2 A3 NC RL3 F RL2 SCL A0 RW3 Package Dimensions Symbol Min Nominal Max Millimeters Package Width a 2.595 2.625 2.655 Package Length b 3.814 3.844 3.874 Package Height c 0.644 0.677 0.710 Body Thickness d 0.444 0.457 0.470 Ball Height e 0.200 0.220 0.240 Ball Diameter f 0.300 0.320 0.340 Ball Pitch – Width j 0.5 Ball Pitch – Length k 0.5 Ball to Edge Spacing – Width l 0.538 0.563 0.588 Ball to Edge Spacing – Length m 0.647 0.672 0.697 24-Bump Chip Scale Package (CSP B24) Package Outline Drawing Top View (Sample Marking) Bottom View (Bumped Side) Side View a A4 A3 A2 A1 f j m l k b d e e c B4 B3 B2 B1 C4 C3 C2 C1 D4 D3 D2 D1 E4 E3 E2 E1 F4 F3 F2 F1 Side View |
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