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AND8058D Datenblatt(PDF) 2 Page - ON Semiconductor

Teilenummer AND8058D
Bauteilbeschribung  Two New Analog Switches Set Standards for Space Efficiency
PDF  4 Pages
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
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AND8058D Datenblatt(HTML) 2 Page - ON Semiconductor

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AND8058/D
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2. Switch between two audio signals in a single phone,
one from a digital baseband detector, the other from
an analog baseband detector, to drive the final audio
output to an ear piece. In this example, it is assumed
that a multifunctional cell phone has both an analog
detector and a digital detector, one of which must be
selected to drive the final audio output to the ear
piece. The NLAS4599 selects the digital or analog
detector output, presenting very low impedance to
the driver amplifier for the selected device and very
high impedance to the deselected device.
Analog
Detector
Digital
Detector
(TDMA, CDMA, GSM)
Control Pin
Audio Amplifier
Figure 2. Switching Between Two Audio Signals
These two examples show how the NLAS4599 can be
used to select from two outputs, such as crystals and digital,
or analog signals under microprocessor control. The
NLAS4599 will stop or pass any signal between GND and
VCC, either digital or analog, and preserve its voltage level.
The device is usable beyond 100 MHz, since the 3 dB point
is beyond 150 MHz.
The NLAS44599
ON Semiconductor has designed a new device in even
smaller spaces with more functionality. The device is placed
in a new package type, being made available and accepted
by JEDEC, called the Fine Pitch Quad Flat No Lead package
(QFN). The specification falls under JEDEC MO–220,
dated January 2000. It calls for packages whose body sizes
range from 3 x 3 mm to 8 x 8 mm. The lead count goes from
4 to 56. The thickness (height off the board) is a maximum
of 1 mm.
ON Semiconductor put a new device, called the
NLAS44599, in a 3 x 3 package. The new device consists of
16 leads with a 0.5 mm pitch. Since the package is “no lead,”
there are no co–planarity issues and no solder bumps. The
user simply applies solder paste to the circuit board, places
the QFN, and uses IR re–flow soldering to complete the
mounting.
With this concept, we were able to put the equivalent of
four of the NLAS4599 SPDT devices into a 9 mm2 package.
Compared to the 4053 in TSSOP, this device is more than
four times as space efficient. With 16 pins, we were able to
construct two independent DPDT switches. These devices
are inherently bilateral. Signals can flow in either direction
and, once turned on, these devices offer almost zero
propagation delay.
See Figure 3 for an example of how to switch LVDS
signals.
+
GND
VCC
3.5 mA
Current Source
100
Transmission Wire or Traces
Xmitter
Receiver
+
+
Figure 3. Low Voltage Differential Signaling



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