STM32F303VB datasheet(146/148 Pages) STMICROELECTRONICS

146 / 148 page

Revision history

STM32F303xB STM32F303xC

146/148

DocID023353 Rev 13

17-Apr-2015

Updated Section 7: Package information: with new package information

structure adding 1 sub paragraph for each package.

Updated Figure 41: LQFP100 – 14 x 14 mm, low-profile quad flat

package top view example removing gate mark.

Added note for all packages about the device marking orientation: “the

following figure gives an example of topside marking orientation versus

pin 1 identifier location”.

Updated Table 82: LQFP64 – 10 x 10 mm, low-profile quad flat package

mechanical data.

11-Dec-2015

Added WLCSP100:

– Updated cover page.

– Updated Table 2: STM32F303xB/STM32F303xC family device

features and peripheral counts.

– Added Figure 7: STM32F303xB/STM32F303xC WLCSP100 pinout.

– Updated Table 13: STM32F303xB/STM32F303xC pin definitions.

– Updated Table 24: General operating conditions.

– Added Section 7.4: WLCSP100 - 0.4 mm pitch wafer level chip scale

package information.

– Updated Table 86: Package thermal characteristics.

– Updated Table 87: Ordering information scheme.

Updated Figure 4, Figure 5, Figure 6, Table 13 and Table 22 removing

all VDD and VSS indexes.

Updated all the notes removing ‘not tested in production’.

Updated Table 68: ADC characteristics adding VREF- negative voltage

reference.

Update Table 21: Voltage characteristics adding table note 4.

Table 88. Document revision history (continued)

Date

Revision

Changes

STM32F303VB Datenblatt(PDF) 146 Page - STMicroelectronics