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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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STNRGPF01 Datenblatt(PDF) 35 Page - STMicroelectronics |
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STNRGPF01 Datenblatt(HTML) 35 Page - STMicroelectronics |
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35 / 40 page  DocID030377 Rev 2 35/40 STNRGPF01 Thermal data 40 6 Thermal data The STNRG functionality cannot be guaranteed when the device, in operation, exceeds the maximum chip junction temperature (TJmax). Equation 1 TJmax = TAmax + (PDmax x JA) Where: TAmax is the maximum ambient temperature in °C JA is the package junction to ambient thermal resistance in °C/W PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax) PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal power. PI/Omax represents the maximum power dissipation on output pins where: PI/Omax = (VOL x IOL) + [(VDD - VOH) x IOH], taking into account the actual VOL/IOL and VOH/IOH of the I/Os at the low and high level. Table 18. Package thermal characteristics Symbol Parameter Value Unit JA TSSOP38 - thermal resistance junction to ambient(1) 1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in natural convection. 80 °C/W |
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