L6759D datasheet(13/51 Pages) STMICROELECTRONICS

13 / 51 page

L6759D

Pin description and connection diagrams

Doc ID 023240 Rev 1

13/51

2.2

Thermal data

Table 3.

Thermal data

SVR_RDY

VR ready.

Open drain output set free after SS has finished in single-phase section

and pulled low when triggering any protection for the single-phase sec-

tion.Pull up to a voltage lower than 3.3 V (typ.), if not used it can be left

floating.

ENDRV

Enable driver.

CMOS output driven high when the IC commands the drivers. Used in

conjunction with the HiZ window on the PWMx pins to optimize the

multi-phase section overall efficiency. Connect directly to external driver

enable pin.

PAD

GND

GND connection. All internal references and logic are referenced to this

pin. Filter to VCC with proper MLCC capacitor and connect to the PCB

GND plane.

Table 2.

Pin description (continued)

Pin#

Name

Function

Symbol

Parameter

Value

Unit

RthJA

Thermal resistance junction to ambient

(device soldered on 2s2p PC board)

°C/W

RthJC

Thermal resistance junction to case

°C/W

TMAX

Maximum junction temperature

150

°C

TSTG

Storage temperature range

-40 to 150

°C

Junction temperature range

0 to 125

°C

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