LQFP100 datasheet(60/116 Pages) STMICROELECTRONICS

60 / 116 page

Package pinouts and signal descriptions

SPC560B40x/50x, SPC560C40x/50x

60/116

DocID14619 Rev 13

3.17

Power management electrical characteristics

3.17.1

Voltage regulator electrical characteristics

The device implements an internal voltage regulator to generate the low voltage core supply

VDD_LV from the high voltage ballast supply VDD_BV. The regulator itself is supplied by the

common I/O supply VDD. The following supplies are involved:



HV—High voltage external power supply for voltage regulator module. This must be

provided externally through VDD_HV power pin.



BV—High voltage external power supply for internal ballast module. This must be

provided externally through VDD_BV power pin. Voltage values should be aligned with

VDD.



LV—Low voltage internal power supply for core, FMPLL and flash digital logic. This is

generated by the internal voltage regulator but provided outside to connect stability

capacitor. It is further split into four main domains to ensure noise isolation between

critical LV modules within the device:

–

LV_COR—Low voltage supply for the core. It is also used to provide supply for

FMPLL through double bonding.

–

LV_CFLA—Low voltage supply for code flash module. It is supplied with dedicated

ballast and shorted to LV_COR through double bonding.

–

LV_DFLA—Low voltage supply for data flash module. It is supplied with dedicated

ballast and shorted to LV_COR through double bonding.

–

LV_PLL—Low voltage supply for FMPLL. It is shorted to LV_COR through double

bonding.

LQFP100 Datenblatt(PDF) 60 Page - STMicroelectronics