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LM621 Datenblatt(PDF) 3 Page - National Semiconductor (TI) |
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LM621 Datenblatt(HTML) 3 Page - National Semiconductor (TI) |
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3 / 12 page ![]() Electrical Characteristics (See Notes) (Continued) Parameter Conditions Typ Tested Design Units Limits Limits DEAD-TIME SECTION High Level Input Voltage DIRECTION Pin 3 e 0V 20 20 V min OUTPUT INHIBIT 20 20 V min DEAD-TIME ENABLE Pin 17 e 0V 20 20 V min High Level Input Current Vin e 5V DIRECTION Pin 3 e 0V 100 150 m A max OUTPUT INHIBIT 60 100 m A max DEAD-TIME ENABLE 200 300 m A max Low Level Input Voltage DIRECTION Pin 3 e 0V 06 04 V max OUTPUT INHIBIT 06 04 V max DEAD-TIME ENABLE 03 02 V max Low Level Input Current DIRECTION Vin e 06V b 100 b 150 m A max OUTPUT INHIBIT Vin e 06V b 60 b 100 m A max DEAD-TIME ENABLE Vin e 0V b 200 b 300 m A max Propagation Delays Dead-Time Off (Inputs to Outputs) (Pin 3 e 0V) OUTPUT INHIBIT 200 ns DIRECTION 200 ns Minimum Clock Period R e 11 kX R1 e 1k 18 m s TCLK (Notes 3 11) C e 200 pF Clock Accuracy R e 30k R1 e 1k g 3% f e 100 kHz (Note 11) C e 420 pF Minimum Dead-Time Dead-Time Off 15 ns Minimum Dead-Time Dead-Time On 2 TCLK COMPLETE CIRCUIT Total Current Drains Outputs Off ICC1 10 mA min ICC1 15 22 30 mA max ICC2 VCC2 e 40V 2 mA min ICC2 36 9 mA max Undervoltage Lockout 36 30 VMAX VCC1 Note 1 Unless otherwise noted ambient temperature (TA) e 25 C Note 2 Unless otherwise noted VCC1 ea50V ‘‘recommended operating range VCC e 45V to 55V’’ VCC2 ea100V ambient temperature e 25 C Note 3 The clock period is typically TCLK e (0756 c 10 b 3)(R a 1) C where T CLK is in ms RisinkX and C is pF Also see selection graph in Typical Characteristics for determining values of R and C Note that the value of R should be no less than 11 kX and C no less than 200 pF Note 4 Tested limits are guaranteed and 100% production tested Note 5 Design limits are guaranteed (but not 100% production tested) at the indicated temperature and supply voltages These limits are not used to calculate outgoing quality levels Note 6 Specifications in boldface apply over junction temperature range of b40 Cto a85 C Note 7 Typical Thermal Resistances OJA (see Note 8) N pkg board mounted 110 CW N pkg socketed 118 CW Note 8 Package thermal resistance indicates the ability of the package to dissipate heat generated on the die Given ambient temperature and power dissipation the thermal resistance parameter can be used to determine the approximate operating junction temperature Operating junction temperature directly effects product performance and reliability Note 9 This part specifically does not have thermal shutdown protection to avoid safety problems related to an unintentional restart due to thermal time constant variations Care should be taken to prevent excessive power dissipation on the die Note 10 Human body model 100 pF discharged through a 1500X resistor Note 11 R1 e 0 for C t 620 pF 3 |
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