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TSV732IST Datenblatt(PDF) 19 Page - STMicroelectronics |
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TSV732IST Datenblatt(HTML) 19 Page - STMicroelectronics |
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19 / 29 page ![]() DocID023708 Rev 2 19/29 TSV731, TSV732, TSV734 Application information 4.6 Initialization time The TSV73x series of devices use a proprietary trimming topology that is initiated at each device power-up and allows excellent Vio performance to be achieved. The initialization time is defined as the delay after power-up which guarantees operation within specified performances. During this period, the current consumption (ICC) and the input offset voltage (Vio) can be different to the typical ones. Figure 22. Initialization phase The initialization time is VCC and temperature dependent. Table 6 sums up the measurement results for different supply voltages and for temperatures varying from -40 °C to 125 °C. 4.7 PCB layouts For correct operation, it is advised to add a 10 nF decoupling capacitors as close as possible to the power supply pins. Table 6. Initialization time measurement results VCC (V) Temperature: -40 °C Temperature: 25 °C Temperature: 125 °C Tinit (ms) ICC phase 1 (mA) Tinit (ms) ICC phase 1 (mA) Tinit (ms) ICC phase 1 (mA) 1.8 37 0.33 3.2 0.40 0.35 0.46 3.3 2.9 1.4 0.95 1.3 0.34 1.2 5 2.4 3.2 0.85 2.4 0.31 2.9 |
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