LM1086-MIL datasheet(4/23 Pages) TI1

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LM1086-MIL

SNVSAX4 – JUNE 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The

value RθJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For

improved thermal resistance and power dissipation for the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP)

(4)

The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Maximum input-to-output voltage differential

LM1086-MIL-ADJ

LM1086-MIL-1.8

LM1086-MIL-2.5

LM1086-MIL-3.3

LM1086-MIL-5

Power dissipation(3)

Internally Limited

Junction temperature (TJ)

(4)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

JUNCTION TEMPERATURE RANGE (TJ)

(1)

C grade

Control section

125

°C

Output section

150

°C

I grade

Control section

−40

125

°C

Output section

−40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM1086-MIL

UNIT

KTT

NDE

NGN

3 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

40.8

23.0

35.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

42.3

16.1

24.2

°C/W

RθJB

Junction-to-board thermal resistance

23.3

4.5

13.2

°C/W

ψJT

Junction-to-top characterization parameter

10.2

2.4

0.2

°C/W

ψJB

Junction-to-board characterization parameter

22.3

2.5

13.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance: control

section/output section

1.5/4

2.9

°C/W

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