| Datenblatt-Suchmaschine für elektronische Bauteile |
|
ASF133 Datenblatt(PDF) 8 Page - Advanced Semiconductor Business Inc. |
|
|
|||||||||||||||||||||||||||||
ASF133 Datenblatt(HTML) 8 Page - Advanced Semiconductor Business Inc. |
|
8 / 9 page ![]() 8/9 ASB Inc. sales@asb.co.kr February 2017 ASF133 4. Package Outline (SOT363, 2.1x2.0x1.0 mm) 5. Surface Mount Recommendation (In mm) 1.48 0.30 0.42 0.50 1.23 0.30 Symbols Dimensions (In mm) MIN NOM MAX A 0.900 1.000 1.10 A1 0.025 0.062 0.10 A2 0.875 0.937 1.00 b 0.200 0.300 0.40 C 0.100 0.125 0.15 D 1.900 2.000 2.10 F 1.150 1.250 1.35 E1 2.000 2.100 2.20 e 0.65BSC e1 1.30BSC L 0.425REF NOTE 1. The number and size of ground via holes in a circuit board are critical for thermal and RF grounding considerations. 2. Recommend is that the ground via holes be placed on the bottom of the ground leads and exposed pad of the device for better RF and thermal performance, as shown in the drawing at the left side. |
|
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |