AD6649EBZ datasheet(41/41 Pages) AD

41 / 41 page

AD6649

Data Sheet

Rev. C | Page 40 of 40

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

0.25 MIN

0.50

0.40

0.30

0.50

BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50 REF

0.05 MAX

0.02 NOM

0.60 MAX

0.60

MAX

SEATING

PLANE

PIN 1

INDICATOR

6.35

6.20 SQ

6.05

PIN 1

INDICATOR

0.30

0.25

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

9.10

9.00 SQ

8.90

8.85

8.75 SQ

8.65

Figure 47. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

9 mm × 9 mm Body, Very Thin Quad

(CP-64-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD6649BCPZ

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-64-4

AD6649BCPZRL7

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-64-4

AD6649EBZ

Evaluation Board with AD6649

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D09635-0-1/14(C)

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