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MPC862 Datenblatt(PDF) 13 Page - Motorola, Inc

Teilenummer MPC862
Bauteilbeschribung  Hardware Specifications
PDF  88 Pages
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Hersteller  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC862 Datenblatt(HTML) 13 Page - Motorola, Inc

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MOTOROLA
MPC862/857T/857DSL Hardware Specifications
13
Thermal Calculation and Measurement
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two resistor
model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the
top of the package. The junction-to-board thermal resistance describes the thermal performance when most
of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of
most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see
Figure 3.
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
0
10
20
30
40
50
60
70
80
90
100
0
2 04 0
6 08 0
Board Temperture Rise Above Ambient Divided by Package
Power
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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