ADD8704

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153AB-1

Figure 38. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU)

Dimensions shown in millimeters

16

5

13

8

9

12

1

4

BOTTOM

VIEW

2.25

2.10 SQ

1.95

0.75

0.60

0.50

0.65 BSC

1.95 BSC

0.35

0.28

0.25

12° MAX

0.20 REF

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

4.0

BSC SQ

3.75

BSC SQ

0.60 MAX

0.60 MAX

0.05 MAX

0.02 NOM

0.80 MAX

0.65 TYP

PIN 1

INDICATOR

1.00

0.85

0.80

COPLANARITY

0.08

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

Figure 39. 16-Terminal Leadless Frame Chip Scale Package [LFCSP] (CP)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADD8704ARU

–40°C to +85°C

14-Lead Thin Shrink SOIC

RU-14

ADD8704ARU-REEL

–40°C to +85°C

14-Lead Thin Shrink SOIC

RU-14

–40°C to +85°C

14-Lead Thin Shrink SOIC

RU-14

–40°C to +85°C

14-Lead Thin Shrink SOIC

RU-14

–40°C to +85°C

16-Terminal Leadless Frame Chip Scale

CP-16

–40°C to +85°C

16-Terminal Leadless Frame Chip Scale

CP-16