| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 Accetek Electronics (Sh... |
1MK201210-R47MF
|
276Kb/3P
|
Ultra-low profile Multilayer Power Inductor
|
|
1MK201610-R47MF
|
276Kb/3P
|
Ultra-low profile Multilayer Power Inductor
|
|
1MK252010-R47MF
|
276Kb/3P
|
Ultra-low profile Multilayer Power Inductor
|
|
1MT201210-R47MF
|
306Kb/8P
|
High Current Shielded Power Inductor
|
|
1MT201610-R47MF
|
306Kb/8P
|
High Current Shielded Power Inductor
|
|
1MT252010-R47MF
|
306Kb/8P
|
High Current Shielded Power Inductor
|
|
1MT322510-R47MF
|
306Kb/8P
|
High Current Shielded Power Inductor
|
 Allied Components Inter... |
AC10-R47M-RC
|
876Kb/1P
|
Axial leaded type, small light weight design
|
|
AC10-R47M-RC
|
885Kb/1P
|
Axial Coated Inductors
|
|
AC10-R47M-RC
|
915Kb/1P
|
Axial Coated Inductors
|
 Abracon Corporation |
AISC-1210-R47
|
2Mb/4P
|
SMD CERAMIC WIRE-WOUND INDUCTORS
12.28.12
|
|
AISC-1210-R47
|
2Mb/4P
|
Epoxy coating protects wound wire
12.28.12
|
|
ASPI-2010-R47
|
1Mb/4P
|
Wire Wound Magnetically Shielded SMD Power Inductor
02.20.13
|
|
ASPI-2510-R47
|
1Mb/3P
|
Low Profile Shielded SMD Chip Power Inductor
09.06.11
|
 Bourns Electronic Solut... |
CE201210-R47J
|
208Kb/2P
|
Multi-Layer Chip Inductors
|
|
CE201210-R47J
|
259Kb/2P
|
Multi-Layer Chip Inductors
|
|
CI201210-R47J
|
751Kb/2P
|
Multi-Layer Chip Inductors
|
 Central Technologies |
CTMC1210-R47J
|
192Kb/1P
|
Wire-wound Chip Inductors - Molded ctparts.
|
|
CTMC1210-R47K
|
192Kb/1P
|
Wire-wound Chip Inductors - Molded ctparts.
|
|
CTMC1210-R47M
|
192Kb/1P
|
Wire-wound Chip Inductors - Molded ctparts.
|