507-19-R Datenblatt, PDF

Hersteller

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Glenair, Inc.	507-190	220Kb/2P	EMI-RFII Crimp-Ring Micro-D Backshell Assembly
	507-195M0902EE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902EG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FEE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FEG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FFE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FFG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M0902FG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002EE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002EG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FEE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FEG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FFE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FFG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M10002FG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M1502EE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M1502EG	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly
	507-195M1502FE	158Kb/2P	EMI/RFI Micro-D Split Backshell Assembly

507-19-R Datenblatt, PDF [Verteiler]

Verteiler	Teilenummer	Hersteller Datenblatt	Bauteilbeschribung	Buy Now
Element14	507-1290	MULTICOMP	SOLDER WIRE, LEAD FREE, 0.5MM, 250G; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diamet...
	507-1318	MULTICOMP	SOLDER WIRE, LEAD FREE, 0.9MM, 250G; Flux Type:Rosin; Solder Alloy:99.3, 0.7 Sn, Cu; External Diamet...

Verteiler	Teilenummer	Hersteller	Bauteilbeschribung	Price	Qty. BuyNow