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Hersteller Teilenummer Datenblatt Bauteilbeschribung Intersil Corporation HSP50307SC 48Kb/8P Burst QPSK Modulator 1996 12 HSP50307SC 236Kb/9P Burst QPSK Modulator October 2000 Search Partnumber : Start with "HSP50307SC" - Total : 56 ( 1/3 Page) Intersil Corporation HSP50307EVAL1 45Kb/5P 2.0GHz to 2.7GHz DownConverter 1999 02 HSP50307 236Kb/9P Burst QPSK Modulator October 2000 HSP50306 37Kb/8P Digital QPSK Demodulator 1998 02 HSP50306 161Kb/8P Digital QPSK Demodulator July 2004 Renesas Technology Corp HSP50306 434Kb/8P Digital QPSK Demodulator Jul 2004 Intersil Corporation HSP50306SC-25 37Kb/8P Digital QPSK Demodulator 1998 02 HSP50306SC-2596 37Kb/8P Digital QPSK Demodulator 1998 02 HSP50306SC-27 37Kb/8P Digital QPSK Demodulator 1998 02 HSP50306SC-27 161Kb/8P Digital QPSK Demodulator July 2004 Renesas Technology Corp HSP50306SC-27 434Kb/8P Digital QPSK Demodulator Jul 2004 Intersil Corporation HSP50306SC-2796 37Kb/8P Digital QPSK Demodulator 1998 02 HSP50306 161Kb/8P Digital QPSK Demodulator July 2004 HSP50307 48Kb/8P Burst QPSK Modulator 1996 12 HSP50307 236Kb/9P Burst QPSK Modulator October 2000 HSP50016 209Kb/31P Digital Down Converter 1999 02 HSP50016 259Kb/30P Digital Down Converter September 2000 HSP50016 259Kb/30P Digital Down Converter September 2000 Renesas Technology Corp HSP50016 780Kb/31P Digital Down Converter Aug 4, 2016

HSP50307SC Datenblatt, PDF [Verteiler]

Verteiler Teilenummer Hersteller Datenblatt Bauteilbeschribung Buy Now Element14 HSP-2 SENSATA/CRYDOM THERMAL PAD, 55.9 X 43.2 X 0.127 MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:... HSP051-4M10 STMICROELECTRONICS DIODE, ESD PROTECTION, 3.6V, QFN-10; Clamping Voltage Vc Max:13V; Diode Case Style:QFN; No. of Pins:...

HSP50307SC Verteiler