| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 Maxim Integrated Produc... |
MAX640
|
166Kb/12P
|
5V/3.3V/3V/Adjustable, High-Efficiency, Low IQ, Step-Down DC-DC Converters
Rev 3; 8/97
|
|
MAX6400
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6400-MAX6405
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6400BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6401
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6401BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6402
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6402BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6403
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6403BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6404
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6404BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6405
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6405BS__-T
|
152Kb/9P
|
關P Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406-MAX6411
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406BS
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406BS22-T
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406BS23-T
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|
|
MAX6406BS24-T
|
144Kb/8P
|
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package
Rev 1; 8/01
|