| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Accetek Electronics (Sh... |
1MK201210-R47MF
|
276Kb/3P |
Ultra-low profile Multilayer Power Inductor
|
|
1MK201610-R47MF
|
276Kb/3P |
Ultra-low profile Multilayer Power Inductor
|
|
1MK252010-R47MF
|
276Kb/3P |
Ultra-low profile Multilayer Power Inductor
|
|
1MT201210-R47MF
|
306Kb/8P |
High Current Shielded Power Inductor
|
|
1MT201610-R47MF
|
306Kb/8P |
High Current Shielded Power Inductor
|
|
1MT252010-R47MF
|
306Kb/8P |
High Current Shielded Power Inductor
|
|
1MT322510-R47MF
|
306Kb/8P |
High Current Shielded Power Inductor
|
Allied Components Inter... |
AC10-R47M-RC
|
876Kb/1P |
Axial leaded type, small light weight design
|
|
AC10-R47M-RC
|
885Kb/1P |
Axial Coated Inductors
|
|
AC10-R47M-RC
|
915Kb/1P |
Axial Coated Inductors
|
Abracon Corporation |
AISC-1210-R47
|
2Mb/4P |
SMD CERAMIC WIRE-WOUND INDUCTORS
12.28.12 |
|
AISC-1210-R47
|
2Mb/4P |
Epoxy coating protects wound wire
12.28.12 |
|
ASPI-2010-R47
|
1Mb/4P |
Wire Wound Magnetically Shielded SMD Power Inductor
02.20.13 |
|
ASPI-2510-R47
|
1Mb/3P |
Low Profile Shielded SMD Chip Power Inductor
09.06.11 |
Bourns Electronic Solut... |
CE201210-R47J
|
208Kb/2P |
Multi-Layer Chip Inductors
|
|
CE201210-R47J
|
259Kb/2P |
Multi-Layer Chip Inductors
|
|
CI201210-R47J
|
751Kb/2P |
Multi-Layer Chip Inductors
|
Central Technologies |
CTMC1210-R47J
|
192Kb/1P |
Wire-wound Chip Inductors - Molded ctparts.
|
|
CTMC1210-R47K
|
192Kb/1P |
Wire-wound Chip Inductors - Molded ctparts.
|
|
CTMC1210-R47M
|
192Kb/1P |
Wire-wound Chip Inductors - Molded ctparts.
|
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