15-800-R Datenblatt, PDF

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	15-80-0061	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
	15-80-0061	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0063	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	15-80-0063	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0065	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	15-80-0065	51Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0067	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
	15-80-0067	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0069	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	15-80-0069	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0081	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
	15-80-0081	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
	15-80-0081	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0083	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	15-80-0083	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0085	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	15-80-0085	46Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
	15-80-0087	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
	15-80-0087	1Mb/7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
	15-80-0087	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,

15-800-R Datenblatt, PDF

15-800-R Datasheet ,PDF

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