| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 Advanced Thermal Soluti... |
ATS-1043-C1-R0_DS
|
2Mb/1P |
maxiFLOW™ Cross Cut High Performance Heat Sinks with Plastic Push Pin
REV1_0908 |
|
ATS-1143-C1-R0
|
337Kb/1P |
Hole pattern fits standard half power brick modules
REV4_0117 |
|
ATS-1183-C1-R0
|
306Kb/1P |
Hole pattern fits standard full power brick modules
REV4_0117 |
|
ATS-56003-C1-R0
|
269Kb/1P |
Comes preassembled with high performance thermal interface material
Rev - 040517 |
|
ATS-56013-C1-R0
|
387Kb/1P |
Comes preassembled with high performance thermal interface material
Rev - 040517 |
|
ATS-59003-C1-R0
|
137Kb/1P |
Designed for flip-chip processors such as NXP MPCs
Rev - 230517 |
|
ATS-60003-C1-R0
|
302Kb/1P |
Comes preassembled with high performance thermal interface material
Rev - 040517 |