| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 National Semiconductor ... | MKT-D14D |  60Kb/ 1P | DIP, SIDEBRAZED CERAMIC 14 LEAD |
| MKT-D20A |  32Kb/ 1P | MKT-D20A |
| MKT-D40J |  34Kb/ 1P | HERMETIC DIP, 40 LEAD, DUAL CAVITY |
 National Semiconductor ... | MKT-E32B |  31Kb/ 1P | LEADLESS CHIP CARRIER, TYPE C, 32 TERMINAL |
| MKT-H04D |  31Kb/ 1P | 4 LEAD.100 DIA P.C.SHIELDED METAL CAN PACKAGE (H) |
| MKT-J16A |  37Kb/ 1P | CERDIP 16 LEAD |
| MKT-J24A |  56Kb/ 1P | CERDIP 24 LEAD 600 CENTERS |
| MKT-K02C |  49Kb/ 1P | METAL CAN, TO-3 2 LEAD LOW PROFILE |
 National Semiconductor ... | MKT-M20B |  44Kb/ 1P | MKT-M20B |
| MKT-MA03B |  49Kb/ 1P | MOLDED PACKAGE SUPER - SOT 3 LEAD |
| MKT-MA04A |  53Kb/ 1P | MOLDED PACKAGE SOT-223 |
| MKT-MA06A |  51Kb/ 1P | MOLDED PACKAGE SUPER SOT 6 LEAD |
| MKT-MF05A |  113Kb/ 1P | MOLDED SOT-23 115 X 063 X 040 IN BODY 5LD 0375 IN PITCH |
| MKT-MF06A |  120Kb/ 1P | MOLDED SOT-23, .115x .063x .040 in 6LD, .0375 in PITCH |
 National Semiconductor ... | MKT-MSA28 |  47Kb/ 1P | MOLDED SSOP |
| MKT-MSC16 |  24Kb/ 1P | MOLDED PACKAGE SSOP, EIAJ |