| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
 STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002 |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 NXP Semiconductors |
SOT108-1
|
10Kb / 1P |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
2003 Mar 24 |
|
SOT340-1
|
11Kb / 1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24 |
 STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Intersil Corporation |
M24.173B
|
42Kb / 1P |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
|
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 STMicroelectronics |
TSSOP14
|
58Kb / 4P |
14-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|