CFP15 Datenblatt(PDF) - Amkor Technology

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CFP15 Datenblatt (PDF) - Amkor Technology

CFP15 Datasheet PDF - Amkor Technology


Teilenummer	CFP15

Download	CFP15 Download

Filegröße	593.78 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Bauteilbeschribung

The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Datasheet (PDF)

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CFP15 Datasheet PDF - Amkor Technology


Teilenummer	CFP15

Download	CFP15 Click to download

Filegröße	593.78 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Datenblatt (HTML) - Amkor Technology

CFP15 Datasheet HTML 1Page - Amkor Technology

CFP15 Datasheet HTML 2Page - Amkor Technology

CFP15 Produktdetails

FEATURES
Cu connector structure to reduce inductance and resistance
Enhanced thermal properties
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Application
With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications.
Schottky Barrier Diodes (SBDs)
Rectifier & Zener Diodes
Transient Voltage Suppressors (TVS)
MOSFETs

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Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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