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CFP15 Datenblatt(PDF) 1 Page - Amkor Technology |
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CFP15 Datenblatt(HTML) 1 Page - Amkor Technology |
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1 / 2 page ![]() Application With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications. f Schottky Barrier Diodes (SBDs) f Rectifier & Zener Diodes f Transient Voltage Suppressors (TVS) f MOSFETs Reliability Qualification Amkor devices are assembled with proven reliable semiconductor materials. f All reliability test include JSTD‑020 moisture pre‑conditioning except high temperature storage f Moisture sensitivity characterization: JEDEC level 1 85°C/85% RH, 168 hours, IR reflow 260°C 3x f uHAST: 130°C/85% RH, no bias, 96 hours f Temperature cycle: ‑65~150°C, 2000 cycles f High temperature storage: 150°C for 1000 hours Test Services Amkor offers full turnkey business for all power products, with the capability to test various types of power devices including MOSFETs, bipolar transistors, IGBTs, diodes and regulator ICs/intelligent power devices. f Amkor power test capability ▷ Static test (DC) ▷ Dynamic test (AC, switching/trr, capacitance/Rg) ▷ Destruction test (inductive load/VSUS) ▷ Thermal resistance (ΔVDS, ΔmV, etc.) f Program generation/conversion f Failure analysis f Available test/handling technology f Integrated marking, vision inspection and tape & reel services The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization. The Cu clip structure of interconnect features reduces electrical resistance and enhances thermal performance compared to wirebonded products. f This package may also be known as ▷ TO277-A ▷ SMPC ▷ CFP15 PSMC DATA SHEET | POWER PRODUCTS FEATURES f Cu connector structure to reduce inductance and resistance f Enhanced thermal properties f Turnkey with test and packing services f Green materials: Pb‑free plating & halogen-free mold compound NEW DEVELOPMENTS f Larger/higher‑density leadframe strips f Environmentally‑friendly Pb‑free solder paste PROCESS HIGHLIGHTS f Bare copper leadframe with no plating f Interconnect: Cu clips technology for better electrical and thermal performance f Plating: 100% Matte Sn f Marking: Pen‑type laser |
Ähnliche Teilenummer - CFP15 |
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Ähnliche Beschreibung - CFP15 |
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