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CFP15 Datenblatt(PDF) 1 Page - Amkor Technology

Teilenummer CFP15
Bauteilbeschribung  The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.
PDF  2 Pages
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Hersteller  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology

CFP15 Datenblatt(HTML) 1 Page - Amkor Technology

  CFP15 Datasheet HTML 1Page - Amkor Technology CFP15 Datasheet HTML 2Page - Amkor Technology  
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Application
With both 2 and 3 lead versions available, the PSMC package is suitable for
high‑efficiency diode as well as transistor applications.
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Schottky Barrier Diodes (SBDs)
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Rectifier & Zener Diodes
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Transient Voltage Suppressors (TVS)
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MOSFETs
Reliability Qualification
Amkor devices are assembled with proven reliable semiconductor materials.
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All reliability test include JSTD‑020 moisture pre‑conditioning except high
temperature storage
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Moisture sensitivity characterization: JEDEC level 1 85°C/85% RH, 168
hours, IR reflow 260°C 3x
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uHAST: 130°C/85% RH, no bias, 96 hours
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Temperature cycle: ‑65~150°C, 2000 cycles
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High temperature storage: 150°C for 1000 hours
Test Services
Amkor offers full turnkey business for all power products, with the
capability to test various types of power devices including MOSFETs, bipolar
transistors, IGBTs, diodes and regulator ICs/intelligent power devices.
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Amkor power test capability
▷ Static test (DC)
▷ Dynamic test (AC, switching/trr, capacitance/Rg)
▷ Destruction test (inductive load/VSUS)
▷ Thermal resistance (ΔVDS, ΔmV, etc.)
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Program generation/conversion
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Failure analysis
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Available test/handling technology
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Integrated marking, vision inspection and tape & reel services
The PSMC package is part of the FLAT series of compact surface
mount packages which allow miniaturization. The Cu clip structure
of interconnect features reduces electrical resistance and enhances
thermal performance compared to wirebonded products.
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This package may also be known as
▷ TO277-A
▷ SMPC
▷ CFP15
PSMC
DATA SHEET | POWER PRODUCTS
FEATURES
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Cu connector structure to reduce
inductance and resistance
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Enhanced thermal properties
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Turnkey with test and packing services
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Green materials: Pb‑free plating &
halogen-free mold compound
NEW DEVELOPMENTS
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Larger/higher‑density leadframe strips
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Environmentally‑friendly Pb‑free solder
paste
PROCESS HIGHLIGHTS
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Bare copper leadframe with no plating
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Interconnect: Cu clips technology
for better electrical and thermal
performance
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Plating: 100% Matte Sn
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Marking: Pen‑type laser


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