QSOP Datenblatt(PDF) - Amkor Technology

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QSOP Datenblatt (PDF) - Amkor Technology

QSOP Datasheet PDF - Amkor Technology


Teilenummer	QSOP

Download	QSOP Download

Filegröße	475.9 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP Datasheet (PDF)

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Download Datenblatt

QSOP Datasheet PDF - Amkor Technology


Teilenummer	QSOP

Download	QSOP Click to download

Filegröße	475.9 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP Datenblatt (HTML) - Amkor Technology

QSOP Datasheet HTML 1Page - Amkor Technology

QSOP Datasheet HTML 2Page - Amkor Technology

QSOP Produktdetails

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Ähnliche Teilenummer - QSOP

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Amkor Technology	QSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
TT Electronics.	QSOP	442Kb / 4P	RoHS compliant and Sn/Pb terminations available
Diodes Incorporated	QSOP-16	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Diodes Incorporated	QSOP-20	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Fairchild Semiconductor	QSOP-24	78Kb / 1P	Package MQA24

Ähnliche Beschreibung - QSOP

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
Analog Devices	RQ-16	60Kb / 1P	16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
ACCUTEK MICROCIRCUIT CO...	AK06D300-QSOP	174Kb / 4P	Quarter Size Small Outline Package QSOP DIP Adapters
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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