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Teilenummer	DA14531MOD

Bauteilbeschribung	SmartBond TINY Bluetooth® LE Module

Filegröße	2446.79 Kbytes

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Hersteller	RENESAS [Renesas Technology Corp]

Direct Link	http://www.renesas.com

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Ähnliche Beschreibung - DA14531MOD

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Infineon Technologies A...	CYBLE-343072-EVAL-M2B	3Mb / 4P	AIROC Bluetooth LE module evaluation kit Rev. A 08 / 2022
Toshiba Semiconductor	TC35667FTG	755Kb / 26P	TC35667FTG Bluetooth® LE Single IC For Bluetooth® Smart November 2014 Rev 1.x
Infineon Technologies A...	CYW20819	508Kb / 52P	AIROC™ Bluetooth® & Bluetooth® LE system-on-chip Ultra low power, Bluetooth® 5.2 Rev. G 2022-07-13
Infineon Technologies A...	CYW20820	631Kb / 59P	AIROC™ Bluetooth® and Bluetooth® LE system on chip Rev. G 2022-09-26
Silicon Laboratories	WT11I-A	1Mb / 46P	WT11i Bluetooth® Module Version 1.64
Renesas Technology Corp	DA16600MOD	965Kb / 28P	Ultra-Low Power Wi-Fi Bluetooth® LE Combo Module 04-Jan-2023
Infineon Technologies A...	CYBLE-343072-02	868Kb / 58P	AIROC™ Bluetooth® LE module 2021-08-12
	CYW20835	791Kb / 46P	AIROC™ Bluetooth® LE system on chip Rev. B 2023-01-18
	CY8C63X6	2Mb / 108P	PSoC™ 63 MCU with Bluetooth® LE Rev. R 2023-05-10
ESPRESSIF SYSTEMS (SHAN...	ESP32-WROOM-32E	1Mb / 33P	2.4 GHz WiFi Bluetooth® Bluetooth LE module 2023