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AMMC-5024 Datenblatt(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED

Teilenummer AMMC-5024
Bauteilbeschribung  30 KHz??0 GHz Traveling Wave Amplifier
PDF  10 Pages
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Hersteller  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Direct Link  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

AMMC-5024 Datenblatt(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED

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Figure 19. AMMC-5024 Schematic.
GND
Drain Bias
(Vdd)
Nine Identical
Vdd AUX
Second Gate
First Gate
Bias (Vg1)
RF_Input
DET_OUT
RF_Output
DET_BIAS
DET_REF
Assembly Techniques
ThebacksideoftheMMICchipisRFground.Formicrostrip
applicationsthechipshouldbeattacheddirectlytothe
groundplane(e.g.circuitcarrierorheatsink)usingelectri-
callyconductiveepoxy[1,2].
Forbestperformance,thetopsideoftheMMICshouldbe
broughtuptothesameheightasthecircuitsurrounding
it.Thiscanbeaccomplishedbymountingagoldplated
metalshim(samelengthastheMMIC)underthechip
whichisofcorrectthicknesstomakethechipandadja-
centcircuitthesameheight.Theamountofepoxyused
forthechiporshimattachmentshouldbejustenoughto
provideathinfilletaroundthebottomperimeterofthe
chip.Thegroundplaneshouldbefreeofanyresiduethat
mayjeopardizeelectricalormechanicalattachment.
RFconnectionsshouldbekeptasshortasreasonableto
minimizeperformancedegradationduetoundesirable
seriesinductance.Asinglebondwireisnormallysuf-
ficientforsingleconnections,howeverdoublebonding
with0.7milgoldwirewillreduceseriesinductance.Gold
thermo-sonicwedgebondingisthepreferredmethod
forwireattachmenttothebondpads.Therecommended
wirebondstagetemperatureis150°c±2°c.
CautionshouldbetakentonotexceedtheAbsoluteMaxi-
mumRatingforassemblytemperatureandtime.
Thechipis100umthickandshouldbehandledwithcare.
ThisMMIChasexposedairbridgesonthetopsurfaceand
shouldbehandledbytheedgesorwithacustomcollet
(donotpickupthediewithavacuumondiecenter).
Bondingpadsandchipbacksidemetallizationaregold.
ThisMMICisalsostaticsensitiveandESDprecautions
shouldbetaken.Eutecticattachisnotrecommendedand
mayjeopardizereliabilityofthedevice.
FormoredetailedinformationseeAvagoTechnologies’
ApplicationNote#5359“GaAsMMICassemblyandhan-
dlingguidelines”.
Notes:
1. Ablebond84-1LMlsilverepoxyisrecommended
2.Eutecticattachisnotrecommendedandmayjeopardizereliability
ofthedevice



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