Figure 21. AMMC-5024 Assembly Diagram.

OUT

IN

Drain bias must be decoupled from

RF to lowest operating frequency

4 nH Inductor for operation

to 2 GHz bond wire

100 pF Capacitor

Gate is decoupled from RF.

(Bond wire length is not important)

Ordering Information

AMMC-5024-W10=10devicespertray

AMMC-5024-W50=50devicespertray

For product information and a complete list of distributors, please go to our web site:

www.avagotech.com

Avago, AvagoTechnologies, and the A logo are trademarks of AvagoTechnologies in the United States and other countries.

Data subject to change. Copyright © 2005-2008 AvagoTechnologies. All rights reserved. Obsoletes 5989-3931EN

AV02-0632EN - September 8, 2008

Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)

1050

960

RF INPUT

235

0

RF Output

90

733

90

2350

0 165

415550

830

Vdd_AUX

DET_Bias

Vdd

2260

GND

1270

DET_Output

DET_Reference

Vg2

485

2250

2080

GND