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TMUX1101, TMUX1102

SCDS410 – MARCH 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

–0.5

6

V

Logic control input pin voltage (SEL)

–0.5

6

V

Logic control input pin current (SEL)

–30

30

mA

Source or drain voltage (S, D)

–0.5

V

Source or drain continuous current (S, D)

–30

30

mA

Storage temperature

–65

150

°C

Junction temperature

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±2000

V

Charged device model (CDM), per JEDEC

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.08

5.5

V

Signal path input/output voltage (source or drain pin) (S, D)

0

V

Logic control input pin voltage (SEL)

0

5.5

V

Ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TMUX1101 / TMUX1102

UNIT

DCK (SC70)

DBV (SOT-23)

5 PINS

5 PINS

Junction-to-ambient thermal resistance

348.5

TBD

°C/W

Junction-to-case (top) thermal resistance

238.3

TBD

°C/W

Junction-to-board thermal resistance

205.7

TBD

°C/W

Junction-to-top characterization parameter

141.4

TBD

°C/W

Junction-to-board characterization parameter

204.7

TBD

°C/W

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W