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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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GD9FS1G8F2AMG Datenblatt(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD9FS1G8F2AMG Datenblatt(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc. |
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48 / 55 page  GD9Fx1GxF2A 48 Dimensions Symbol A A1 A2 b D Hd E E1 e L L1 θ Unit mm Min - 0.05 0.90 0.14 18.30 19.80 11.90 - 0.50 0.425 0.60 0 Nom - 0.10 1.00 0.22 18.40 20.00 12.00 - 0.525 0.80 - Max 1.20 0.15 1.10 0.30 18.50 20.20 12.10 12.40 0.625 1.00 7 Note： 1. Tolerance of the dimension should be ±0.1 unless otherwise specified. 2. Corner radius should be less than ±0.1R unless otherwise specified (excluding outer lead). 3. Tolerance of the angles should be ±0.5 degree unless otherwise specified. 4. The mold surface should have a finish 8±2S without luster. Trace of knockout pin and the ahaded portion of detail “A” should be polish surface. 5. Discrepancies between upper and lower molding cavity should be less than 0.05 of the package. 6. Mold flash should be less than 0.2mm. |
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