Data Sheet M10693EJ7V0DS00

18

µµµµPD43257B

Recommended Soldering Conditions

The following conditions must be met when soldering

µPD43257B. For more details, refer to our document

“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

Types of Surface Mount Device

µPD43257BGU-xxL

: 28-PIN PLASTIC SOP (11.43 mm (450))

µPD43257BGU-xxLL : 28-PIN PLASTIC SOP (11.43 mm (450))

Please consult with our sales offices.

Types of Through Hole Mount Device

µPD43257BCZ-xxL

: 28-PIN PLASTIC DIP (15.24 mm (600))

µPD43257BCZ-xxLL : 28-PIN PLASTIC DIP (15.24 mm (600))

Soldering process

Soldering conditions

Wave soldering (only to leads)

Solder temperature : 260

°C or below,

Flow time : 10 seconds or below

Partial heating method

Terminal temperature : 300

°C or below,

Time : 3 seconds or below (Per one lead)

Caution Do not jet molten solder on the surface of package.