FXPS7115D4 datasheet(60/72 Pages) NXP

60 / 72 page

NXP Semiconductors

FXPS7115D4

Digital absolute pressure sensor, 40 kPa to 115 kPa

FXPS7115D4

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 5 December 2019

60 / 72

14 Application information

The FXPS7115D4 sensor can operate in two modes: I2C and SPI. The application

diagrams in Figure 25 and Figure 26 show the modes and their respective biasing and

bypass components.

The sensor can be configured to operate in SPI mode to read the user registers, self-test

and diagnostics information. The application diagram in Figure 26 shows the SPI and the

respective biasing and bypass components.

Note: A gel is used to provide media protection against corrosive elements which

may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas

molecules may permeate through the gel and then occupy boundaries between material

surfaces within the sensor package. When decompression occurs, the gas molecules

may collect, form bubbles and possibly result in delamination of the gel from the material

it protects. If a bubble is located on the pressure transducer surface or on the bond wires,

the sensor measurement may shift from its calibrated transfer function. In some cases,

these temporary shifts could be outside the tolerances listed in the data sheet. In rare

cases, the bubble may bend the bond wires and result in a permanent shift.

aaa-029732

VCC

INT

FXPS7xxxD4

SCL

SDA

VSS

VCCIO

Figure 25. I2C application diagram of FXPS7115D4

Table 103. External component recommendations for I2C

Name

Type

Description

Purpose

Ceramic

0.1 μF, 10 %, 10 V minimum, X7R

VCC power supply decoupling

General purpose

1000 Ω, 5 %, 200 PPM

I2C selection pin pull-up resistor

General purpose

1000 Ω, 5 %, 200 PPM

Serial clock pull-up resistor

General purpose

1000 Ω, 5 %, 200 PPM

Serial data pull-up resistor

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