September 2005

ASM5P2308A

rev 1.4

3.3V Zero Delay Buffer

11 of 18

Notice: The information in this document is subject to change without notice.

Package Information

16-lead (150 Mil) Molded SOIC Package

E

H

A

A1

A2

D

e

B

θ

L

C

h

Seating Plane

0.004

PIN 1 ID

1

8

916

Dimensions

Inches

Millimeters

Symbol

Min

Max

Min

Max

A

0.053

0.069

1.35

1.75

A1

0.004

0.010

0.10

0.25

A2

0.049

0.059

1.25

1.50

B

0.013

0.022

0.33

0.53

C

0.008

0.012

0.19

0.27

D

0.386

0.394

9.80

10.01

E

0.150

0.157

3.80

4.00

e

0.050 BSC

1.27 BSC

H

0.228

0.244

5.80

6.20

h

0.010

0.016

0.25

0.41

L

0.016

0.035

0.40

0.89

θ

0°

8°

0°

8°