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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TLV9152SIRUGR Datenblatt(PDF) 11 Page - Texas Instruments |
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TLV9152SIRUGR Datenblatt(HTML) 11 Page - Texas Instruments |
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11 / 63 page  11 TLV9151, TLV9152, TLV9154 www.ti.com SBOS986B – OCTOBER 2019 – REVISED MAY 2020 Product Folder Links: TLV9151 TLV9152 TLV9154 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for TLV9152. 6.5 Thermal Information for Dual Channel THERMAL METRIC (1) TLV9152, TLV9152S UNIT D (SOIC) DDF (2) (SOT-23-8) DGK (2) (VSSOP) DGS (2) (VSSOP) DSG (WSON) PW (TSSOP) RUG (X2QFN) 8 PINS 8 PINS 8 PINS 10 PINS 8 PINS 8 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 138.7 TBD TBD TBD 77.6 185.1 142.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.7 TBD TBD TBD 93.7 74.0 53.5 °C/W RθJB Junction-to-board thermal resistance 82.2 TBD TBD TBD 43.9 115.7 68.5 °C/W ψJT Junction-to-top characterization parameter 27.8 TBD TBD TBD 4.4 12.3 1.0 °C/W ψJB Junction-to-board characterization parameter 81.4 TBD TBD TBD 43.9 114.0 68.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A TBD TBD TBD 19.0 N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for TLV9154. 6.6 Thermal Information for Quad Channel THERMAL METRIC (1) TLV9154, TLV9154S UNIT D (2) (SOIC) PW (2) (TSSOP) RTE (2) (WQFN) RUC (2) (WQFN) 14 PINS 14 PINS 16 PINS 16 PINS 14 PINS RθJA Junction-to-ambient thermal resistance TBD TBD TBD TBD TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD TBD TBD TBD TBD °C/W RθJB Junction-to-board thermal resistance TBD TBD TBD TBD TBD °C/W ψJT Junction-to-top characterization parameter TBD TBD TBD TBD TBD °C/W ψJB Junction-to-board characterization parameter TBD TBD TBD TBD TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance TBD TBD TBD TBD TBD °C/W |
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