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TLV9152SIRUGR Datenblatt(PDF) 12 Page - Texas Instruments

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Teilenummer TLV9152SIRUGR
Bauteilbeschribung  TLV915x 4.5-MHz, Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp
PDF  76 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TLV9152SIRUGR Datenblatt(HTML) 12 Page - Texas Instruments

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6.5 Thermal Information for Dual Channel
THERMAL METRIC (1)
TLV9152, TLV9152S
UNIT
D
(SOIC)
DDF
(SOT-23-8)
DGK
(VSSOP)
DSG
(WSON)
PW
(TSSOP)
RUG
(X2QFN)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
10 PINS
RθJA
Junction-to-ambient thermal
resistance
138.7
143.5
176.5
77.6
185.1
142.3
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
78.7
79.9
68.1
93.7
74.0
53.5
°C/W
RθJB
Junction-to-board thermal
resistance
82.2
61.6
98.2
43.9
115.7
68.5
°C/W
ψJT
Junction-to-top
characterization parameter
27.8
5.7
12.0
4.4
12.3
1.0
°C/W
ψJB
Junction-to-board
characterization parameter
81.4
61.3
96.7
43.9
114.0
68.4
°C/W
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
N/A
N/A
N/A
19.0
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.6 Thermal Information for Quad Channel
THERMAL METRIC (1)
TLV9154, TLV9154S
UNIT
D
(SOIC)
PW
(TSSOP)
RUC
(WQFN)
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
101.4
131.4
125.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
57.6
51.8
39.8
°C/W
RθJB
Junction-to-board thermal resistance
57.3
75.8
68.0
°C/W
ψJT
Junction-to-top characterization parameter
18.5
7.9
0.8
°C/W
ψJB
Junction-to-board characterization parameter
56.9
74.8
67.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
TLV9151, TLV9152, TLV9154
SBOS986D – OCTOBER 2019 – REVISED MAY 2021
www.ti.com
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TLV9151 TLV9152 TLV9154



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