ADP2311ACPZ-2-R7 datasheet(6/20 Pages) AD

6 / 20 page

ADP2311

Data Sheet

Rev. B | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN1, PVIN2, EN

−0.3 V to +20 V

SW1, SW2

−1 V to +20 V

BST1, BST2

VSW + 6 V

FB1, FB2, WDI, RSTO, VM2, TIMER,

POR, PFO, PFI

−0.3 V to +6 V

VREG

−0.3 V to +6 V

PGNDx to GND

−0.3 V to +0.3 V

Operating Temperature Range

(Junction)

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. θJA is

measured using natural convection on a JEDEC 4-layer board

with the exposed pad soldered to the printed circuit board

(PCB) and with thermal vias.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

24-Lead LFCSP_WQ

36.8

1.64

°C/W

ESD CAUTION

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