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SN74HCS367 Datenblatt(PDF) 11 Page - Texas Instruments |
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SN74HCS367 Datenblatt(HTML) 11 Page - Texas Instruments |
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11 / 30 page ![]() Package We able Flank Lead PCB Pad Standard Lead Package Solder Figure 8-3. Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering Wettable flanks help improve side wetting after soldering which makes QFN packages easier to inspect with automatic optical inspection (AOI). A wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet as shown in Figure 8-3. Please see the mechanical drawing for additional details. 8.4 Device Functional Modes Function Table lists the functional modes of the SN74HCS367-Q1. Table 8-1. Function Table INPUTS(1) (2) OUTPUTS(1) (2) xOE xAn xYn L L L L H H H X Z (1) H = High Voltage Level, L = Low Voltage Level, X = Don't Care, Z = High-Impedance State (2) x = bank number, n = channel number www.ti.com SN74HCS367-Q1 SCLS816A – SEPTEMBER 2020 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: SN74HCS367-Q1 |
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