STM32WLE4JC datasheet(138/146 Pages) STMICROELECTRONICS

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Package information

STM32WLE5/E4xx

138/146

DS13105 Rev 9

Figure 34. UFBGA73 - Recommended footprint

0.13

0.0051

0.32

0.0126

b(3)

0.24

0.29

0.34

0.0094

0.0114

0.0134

4.85

5.00

5.15

0.1909

0.1969

0.2028

4.00

0.1575

4.85

5.00

5.15

0.1909

0.1969

0.2028

4.00

0.1575

0.50

0.0197

0.50

0.0197

ddd

0.08

0.0031

eee(4)

0.15

0.0059

fff(5)

0.05

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. - UFBGA stands for Ultra-Thin Profile Fine Pitch Ball Grid Array.

- Ultra Thin profile: 0.50 < A ≤ 0.65mm / Fine pitch: e < 1.00mm pitch.

- The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A Max = A1 Typ + A2 Typ + A4 Typ + √ (A1²+A2²+A4² tolerance values)

3. The typical balls diameters before mounting is 0.20 mm.

4. The tolerance of position that controls the location of the pattern of balls with respect to datum A and B. For

each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true position

with respect to datum A and B as defined by e. The axis perpendicular to datum C of each ball must lie

within this tolerance zone.

5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each

tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each ball

must lie simultaneously in both tolerance zones.

Table 96. UFBGA73 - Mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

MSv62396V1

Dsm

Dpad

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