6 Pin Configuration and Functions

1

IN–

12

G02+

2

RG

11

OUT+

3

RG

10

OUT–

4

IN+

9

G02–

Not to scale

Thermal Pad

Figure 6-1. RGT (16-Pin VQFN) Package, Top View

Table 6-1. Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

FDA_IN–

15

Input

Connection to output driver summing node. This pin is internally non-connected on

preliminary samples, but will have full functionality in the final device release.

FDA_IN+

6

Input

Connection to output driver summing node. This pin is internally non-connected on

preliminary samples, but will have full functionality in the final device release.

G02–

9

Input

Connection to gain network

G02+

12

Input

Connection to gain network

IN–

1

Input

Negative (inverting) input

IN+

4

Input

Positive (noninverting) input

NC

8

—

No connect

OUT–

10

Output

Output

OUT+

11

Output

Output

RG

2,3

—

Gain setting pin. Place a gain resistor between pin 2 and pin 3.

VCLAMP–

5

Input

Level set for output clamp value

VCLAMP+

16

Input

Level set for output clamp value

VOCM

13

Input

Level set for output common mode value

VS–

7

Power

Negative supply

VS+

14

Power

Positive supply

Thermal Pad

Thermal pad

—

The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad

to a plane or large copper pour that is either floating or electrically connected to VS–, even

for applications that have low power dissipation.

INA851

SBOS999 – MARCH 2022

www.ti.com

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