VSC8540RT datasheet(80/87 Pages) MICROCHIP

80 / 87 page

VSC8540RT

DS60001603E-page 80

 2022 Microchip Technology Inc. and its subsidiaries

9.1.1

MARKING

Top marking follows the example shown below:

Where:

Line 1 = Microchip Logo

Line 2 and 3 = Device Name

Line 4 = Traceability Code

9.1.2

THERMAL SPECIFICATIONS

Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These documents are

available on the JEDEC website at www.jedec.org. The thermal specifications are modeled using a four-layer test board

with two signal layers, a power plane, and a ground plane (2s2p PCB). For more information about the thermal mea-

surement method used for this device, see the JESD51-1 standard.

To achieve results similar to the modeled thermal measurements, the guidelines for board design described in the

JESD51 family of publications must be applied. For information about applications using VQFN packages, see the fol-

lowing:

• JESD51-2A, Integrated Circuits Thermal Test Method Environmental Conditions, Natural Convection (Still Air)

• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions, Forced Convection (Moving Air)

• JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions, Junction-to-Board

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mecha-

nisms

9.1.3

MOISTURE SENSITIVITY

9.1.4

This device is rated moisture sensitivity level 3 or better as specified in the joint IPC and JEDEC standard

IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.

9.2

68-Pin Ceramic Quad Flat Package

The package is a lead-free (Pb-free), 68-pin, Ceramic Quad Flat Package (CQFP) with a heat slug, 13.05 mm × 13.05

mm body size, 0.635 mm pin pitch and 3.68 mm maximum height.

The heat slug used for ground has the same size as the exposed pad of the VQFN68.

The package lid is connected to ground.

TABLE 9-1:

THERMAL RESISTANCES

Symbol

°C/W

Parameter

JB

5.6

Die junction to printed circuit board (vacuum environment)

JA

26.6

Die junction to ambient (air environment)

JMA at 1 m/s

20.0

Die junction to moving air measured at an air speed of 1 m/s

JMA at 2 m/s

19.0

Die junction to moving air measured at an air speed of 2 m/s

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