7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Input voltage

VDD

30

V

Input current

IVDD

30

mA

Output drive current (peak)

±1

A

5

µJ

Analog input voltage

COMP, CS, FB, RT/CT

–0.3

6.3

V

Output driver voltage

OUT

–0.3

30

Reference voltage

VREF

7

Error amplifier output sink current

COMP

10

mA

D package

50

°C/W

DGK package

120

300

°C

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltages are with respect to GND pin. Currents are positive into and negative out of the specified terminals.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

28

V

Output driver voltage

28

V

Average output driver current(1)

200

mA

Reference output current(1)

–20

mA

Operating junction temperature(1)

UCC28C5x

–40

125

°C

UCC38C5x

0

85

(1)

TI recommends against operating the device under conditions beyond those specified in this table for extended periods of time.

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SLUSER8 – JUNE 2022

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