| Datenblatt-Suchmaschine für elektronische Bauteile |
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LM324DR2G Datenblatt(PDF) 16 Page - ON Semiconductor |
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LM324DR2G Datenblatt(HTML) 16 Page - ON Semiconductor |
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16 / 17 page ![]() TSSOP−14 WB CASE 948G ISSUE C DATE 17 FEB 2016 SCALE 2:1 1 14 DIM MIN MAX MIN MAX INCHES MILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ___ _ S U 0.15 (0.006) T 2X L/2 S U M 0.10 (0.004) V S T L −U− SEATING PLANE 0.10 (0.004) −T− SECTION N−N DETAIL E J J1 K K1 DETAIL E F M −W− 0.25 (0.010) 8 14 7 1 PIN 1 IDENT. H G A D C B S U 0.15 (0.006) T −V− 14X REF K N N GENERIC MARKING DIAGRAM* XXXX XXXX ALYWG G 1 14 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package 7.06 14X 0.36 14X 1.26 0.65 DIMENSIONS: MILLIMETERS 1 PITCH SOLDERING FOOTPRINT (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98ASH70246A DOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 TSSOP−14 WB onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com |
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