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AS1120

Data Sheet

4 Absolute Maximum Ratings

Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical

Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 1. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

Comments

Positive Supply Voltage to Ground

-0.3

+7.0

V

Ground

V

Input Current (Latchup Immunity)

-200

+200

mA

Norm: JEDEC 17

Maximum Junction Temperature

+150

ºC

Storage Temperature

-65

+150

ºC

Package Power Dissipation

760

mW

Package related

ESD

Electrostatic Discharge

1000

V

HBM Mil-Std883E 3015.7 methods

Humidity (Non-Condensing)

5

85

%

Package Body Temperature

+250

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-020C

“Moisture/Reflow Sensitivity Classification

for non-hermetic Solid State Surface

Mount Devices”