Document Number: 28729

For technical questions contact: ff3dresistors@vishay.com

www.vishay.com

Revision: 24-Feb-04

9

PR01/02/03

Power Metal Film Resistors

Vishay BCcomponents

100

0

0.4

1.2

0

0.8

20

40

60

80

∆T

(K)

P (W)

15 mm

20 mm

25 mm

PR01 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.6 mm FeCu-leads.

Minimum distance from resistor body to PCB = 1 mm.

200

0

0.8

2.4

0

1.6

40

80

120

160

∆ T

(K)

P (W)

PR02 Hot-spot temperature rise (∆T) as a function of

dissipated power.

Ø0.8 mm Cu-leads.

02

100

0

20

40

60

80

1

15 mm

20 mm

25 mm

∆ T

(K)

P (W)

PR02 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.8 mm Cu-leads.

Minimum distance from resistor body to PCB = 1 mm.

200

240

0

0.8

2.4

0

1.6

40

80

120

160

∆ T

(K)

P (W)

PR02 Hot-spot temperature rise (∆T) as a function of

dissipated power.

Ø0.6 mm FeCu-leads.

Application Information

02

100

0

20

40

60

80

1

15 mm

20 mm

25 mm

∆ T

(K)

P (W)

PR02 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.6 mm FeCu-leads.

Minimum distance from resistor body to PCB = 1 mm.

240

200

01

0

2

40

80

120

160

∆T

(K)

P (W)

PR02 Hot-spot temperature rise (∆T) as a function

of dissipated power.

Ø0.8 mm FeCu-leads.