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Document Number: 28729

10

Revision: 24-Feb-04

PR01/02/03

Vishay BCcomponents

Power Metal Film Resistors

100

0

1.6

2.4

0

0.8

20

40

60

80

∆T

(K)

P (W)

15 mm

20 mm

25 mm

PR02 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.8 mm FeCu-leads.

Minimum distance from resistor body to PCB = 1 mm.

200

01

3

0

2

40

80

120

160

∆ T

(K)

P (W)

PR03 Hot-spot temperature rise (∆T) as a function of

dissipated power.

Ø0.8 mm Cu-leads.

100

01

3

0

2

20

40

60

80

∆ T

(K)

P (W)

15 mm

20 mm

25 mm

PR03 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.8 mm Cu-leads.

Minimum distance from resistor body to PCB = 1 mm.

200

240

01

3

0

2

40

80

120

160

∆ T

(K)

P (W)

PR03 Hot-spot temperature rise (∆T) as a function of

dissipated power.

Ø0.6 mm FeCu-leads.

Application Information

100

01

3

0

2

20

40

60

80

∆ T

(K)

P (W)

15 mm

10 mm

20 mm

25 mm

PR03 Temperature rise (∆T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ø0.6 mm FeCu-leads.

Minimum distance from resistor body to PCB = 1 mm.

240

200

01

0

3

2

40

80

120

160

∆T

(K)

P (W)

PR03 Hot-spot temperature rise (∆T) as a function of

dissipated power.

Ø0.8 mm FeCu-leads.