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STM32G0C1NET3 Datenblatt(PDF) 150 Page - STMicroelectronics |
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STM32G0C1NET3 Datenblatt(HTML) 150 Page - STMicroelectronics |
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150 / 159 page ![]() Package information STM32G0C1xC/xE 150/159 DS13564 Rev 4 Figure 62. Recommended footprint for UFBGA100 package eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 91. UFBGA100 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 90. UFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0C2_FP_V1 Dpad Dsm |
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